WIA-SEMI-003: 2.5D/3D IC Packaging Standard
Standardized data structures for 2.5D/3D packaging designs including die placement, interconnect topology, and thermal maps.
TypeScript/JavaScript SDK for packaging simulation, design rule checking, and integration with EDA tools.
Best practices for chiplet integration, HBM stacking, thermal management, and signal integrity.
Seamless integration with industry-standard EDA platforms, simulation tools, and manufacturing workflows.
Interposer-based multi-die integration with advanced routing capabilities
Through-Silicon Via (TSV) technology for vertical die stacking
Heterogeneous integration of multiple chiplets with standardized interfaces
High Bandwidth Memory integration with optimized thermal and electrical design
Advanced thermal simulation and hotspot prediction for multi-die packages
High-speed interconnect modeling and optimization for Gb/s data rates
Multi-level power distribution network design and analysis
Design for Manufacturing rules and yield optimization