📦 WIA Advanced Packaging Simulator

Interactive 2.5D/3D IC Design and Analysis Tool

🏗️ 2.5D Design

📚 3D Stack

🔌 Interconnect

🌡️ Thermal

📋 Logs

2.5D Interposer Design

Configure your 2.5D package with multiple dies on an interposer substrate.

Number of Dies

Interposer Size (mm)

Die Size (mm)

Routing Layers

1600 Total Area (mm²)

85 Interconnect Density (%)

2.4 Bandwidth (TB/s)

125 Power (W)

3D IC Stacking with TSVs

Design vertical die stacks with Through-Silicon Vias (TSVs).

Number of Layers

TSV Diameter (μm)

TSV Pitch (μm)

Die Thickness (μm)

200 Stack Height (μm)

2048 TSV Count

0.8 Latency (ns)

4.2 Bandwidth (TB/s)

Interconnect Design & Analysis

Optimize high-speed interconnects between dies.

Data Rate (Gb/s)

Number of Channels

Interconnect Type

Trace Length (mm)

Click "Analyze Interconnect" to run signal integrity analysis...

14.3 Total Bandwidth (TB/s)

-2.3 Signal Loss (dB)

12.5 Jitter (ps)

68 Eye Opening (%)

Thermal Analysis

Analyze thermal behavior and hotspots in your package.

Power per Die (W) 50W

Ambient Temperature (°C) 25°C

Cooling Solution

TIM Thickness (μm)

🟦 Cool (25°C) 🟩 Moderate (50°C) 🟨 Warm (75°C) 🟧 Hot (100°C) 🟥 Critical (125°C)

87.5 Max Temperature (°C)

65.2 Avg Temperature (°C)

0.35 Thermal Resistance (°C/W)

2 Hotspot Count

Simulation Logs

Real-time logs and analysis results from all simulations.

[SYSTEM] WIA Advanced Packaging Simulator initialized

[SYSTEM] Version 1.0.0 - WIA-SEMI-003 Standard

[READY] All simulation engines loaded successfully