Modular chip design and integration for next-generation semiconductors
Standardized chiplet data structures for design, specifications, and metadata exchange between different vendors and tools.
Unified programming interface for chiplet configuration, die-to-die communication, and runtime management across platforms.
UCIe-compliant design guidelines, electrical specifications, and verification protocols for modular chip architectures.
Multi-die integration framework supporting heterogeneous chiplet combinations with advanced packaging technologies.
Full compliance with Universal Chiplet Interconnect Express (UCIe) specification for standardized die-to-die connectivity.
High-speed, low-latency communication protocols enabling seamless data transfer between chiplets at multi-gigabit rates.
Flexible integration framework supporting heterogeneous dies from multiple vendors in a single package.
Advanced power management, thermal optimization, and performance tuning capabilities for chiplet systems.
Comprehensive testing methodologies and reliability protocols for multi-chiplet architectures.
Open standard enabling broad industry collaboration and interoperability across the chiplet ecosystem.