WIA Chiplet Simulator

Interactive Chiplet Architecture Design & Simulation

Available Chiplets

Select chiplets to add to your system design

๐Ÿ’ป Compute Chiplet

Process: 3nm FinFET
Cores: 16x ARM v9
Frequency: 3.5 GHz
Power: 45W TDP
UCIe: 32 lanes

๐Ÿ—„๏ธ Memory Chiplet

Process: 7nm DRAM
Capacity: 32GB HBM3
Bandwidth: 1.2 TB/s
Power: 12W TDP
UCIe: 64 lanes

๐Ÿค– AI Accelerator

Process: 5nm
TOPs: 500 INT8
Tensor Cores: 256
Power: 35W TDP
UCIe: 32 lanes

๐Ÿ”Œ I/O Chiplet

Process: 14nm
PCIe: 5.0 x16
Ethernet: 200Gb/s
Power: 8W TDP
UCIe: 16 lanes

๐ŸŽฎ Graphics Chiplet

Process: 4nm
Cores: 128 CUs
TFLOPS: 40 FP32
Power: 50W TDP
UCIe: 32 lanes

๐Ÿ›ก๏ธ Security Chiplet

Process: 22nm
Crypto: AES-256
TPM: 2.0
Power: 2W TDP
UCIe: 8 lanes

Current System Configuration

Select chiplets to build your system

UCIe Interface Configuration

Bandwidth
512
GB/s
Latency
4.2
ns
Energy Efficiency
0.42
pJ/bit
Total Power
3.2
W

Signal Integrity Analysis

Package Integration

2.5D Silicon Interposer
๐Ÿ’ป
Compute
๐Ÿ—„๏ธ
Memory
๐Ÿ”Œ
I/O
Package Size
42.5
mm ร— 42.5 mm
Die Count
3
chiplets
Yield Estimate
78
%
Cost Index
85
relative

System Performance Metrics

Total Compute
128
TFLOPS
Memory Bandwidth
1200
GB/s
System Power
152
W
Performance/Watt
0.84
TFLOPS/W
Compute Load 75%
Memory Load 60%
I/O Load 40%

Thermal Analysis

Junction Temp
72
ยฐC
Ambient Temp
25
ยฐC
Thermal Margin
28
ยฐC
Cooling Power
15
W

System Logs

[2025-12-27 10:00:00] System initialized successfully
[2025-12-27 10:00:01] UCIe interface configuration loaded
[2025-12-27 10:00:02] Chiplet discovery started
[2025-12-27 10:00:03] Found 3 chiplets in system
[2025-12-27 10:00:04] Power management initialized
[2025-12-27 10:00:05] Thermal monitoring active