WIA Semiconductor Equipment Simulator

Lithography, Etch, Deposition, Inspection with SECS/GEM

Equipment Specifications

🔢 Throughput & Yield

📡 SECS/GEM Protocol

🔗 Fab Automation

🧪 Equipment Qualification

Equipment Specifications

Equipment Type:

Manufacturer:

Model Number:

Wafer Size (mm):

Process Node (nm):

🔢 Throughput & Yield Calculations

Throughput Formula

WPH (Wafers Per Hour) = 3600 / (Process Time + Load/Unload Time + Overhead Time)

Process Time per Wafer (seconds):

Load/Unload Time (seconds):

Overhead Time (seconds):

Equipment Uptime (%):

Defect Rate (ppm):

📡 SECS/GEM Protocol

SECS/GEM Standards

• SEMI E5 (SECS-II): Message format and protocol
• SEMI E30 (GEM): Generic Equipment Model
• SEMI E37 (HSMS): High-Speed SECS Message Services
• SEMI E40 (PJM): Processing Job Management

SECS Message Type:

Equipment ID:

Custom Data (JSON format):

🔗 Fab Automation Integration

Integration Type:

Lot ID:

Recipe ID:

Control Parameters (JSON):

🧪 Equipment Qualification

Qualification Phases

• IQ (Installation Qualification): Verify installation
• OQ (Operational Qualification): Test operations
• PQ (Performance Qualification): Validate performance
• CQ (Continuous Qualification): Ongoing monitoring

Qualification Phase:

Test Wafers Count:

Target Yield (%):

Overlay Spec (nm):

Uniformity Spec (%):