Semiconductor Design — WIA-SEMI-DESIGN-001
Synthesisable SystemVerilog 2017 IEEE 1800 subset, finite state machine encoding (one-hot vs binary), clock-domain crossing per CDC envelope, gray code per RFC 4226 HOTP appendix C analogue.
This chapter elaborates on the RTL Design Methodology portion of Semiconductor Design (WIA-SEMI-DESIGN-001). The semiconductor design canonical envelope shape, API surface, and protocol exchanges are designed to interoperate across implementations published under the WIA Standards family. Each Phase file in `spec/` documents one architectural layer (envelopes, REST surface, federation, ecosystem) and the present chapter focuses on the rtl design methodology subset of that layering.
Implementations of rtl design methodology need to reconcile the per-standard expectations of IEEE 1801-2024 (UPF Power Intent), IEEE 1685-2022 (IP-XACT), Accellera SystemVerilog 2017 + UVM 1.2, IEC 61508-3 (Functional safety), ISO 26262-11 (Hardware in road vehicles). The Phase 1 envelope class for Semiconductor Design carries the per-host identifier and per-tenant identifier so that audit records can be reconstructed across hosts that federate through the Phase 3 protocol layer.
Operators stepping into rtl design methodology typically follow this trajectory: stand up the reference simulator at `simulator/index.html`, walk the canonical envelope per the CLI helper at `cli/semiconductor-design.sh envelope`, then exercise the Phase 2 endpoints with curl/Postman against a host running the reference container at `wia/semiconductor-design-host:1.0.0`. Once those steps complete, integrators wire the real backend one endpoint at a time per the Phase 1 §A.* envelope catalogue and the Phase 2 §B.* endpoint catalogue.
A common operational concern in the rtl design methodology space is observability. Every Phase 1 envelope SHOULD emit a structured log line at the host's audit transport with: timestamp per RFC 3339, host identifier, tenant identifier, envelope class, envelope identifier, operation outcome, and a W3C Trace Context `traceparent` propagated end-to-end. Phase 2 surfaces this trace identifier as the `X-WIA-Trace-Id` response header. Phase 3 protocol exchanges propagate the trace identifier inside the exchange envelope so that a federation crossing remains correlatable end-to-end.
The rtl design methodology portion of the standard composes with: WIA-OMNI-API for credential storage, WIA-AIR-SHIELD for runtime trust list, WIA-INTENT for workload intent declaration, and WIA Secure Enclave for sealed-data envelopes where personal data is processed. The composition lets one host running multiple WIA family standards reuse one identity, one signing-key chain, and one audit transport rather than maintaining N parallel per-standard implementations.
spec/ (Phase 1 for envelopes, Phase 2 for API, Phase 3 for protocol, Phase 4 for ecosystem)../cli/semiconductor-design.sh envelope emits a sample Phase 1 envelope.simulator/index.html.https://github.com/WIA-Official/wia-semiconductor-design-conformance.This chapter, like every other Phase 1-4 chapter in the Semiconductor Design eBook, composes with the wider WIA Standards family. Implementations that adopt the canonical envelope reuse the cross-standard audit transport (W3C Trace Context plus OpenTelemetry semantic conventions), the cross-standard identity (WIA-OMNI-API), and the cross-standard runtime trust list (WIA-AIR-SHIELD) without per-standard re-implementation. The federation handshake described in Phase 3 §3 follows the same challenge-response pattern as the rest of the WIA Standards family so that one operator can federate across multiple standards using one signing-key chain and one audit transport.