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Semiconductor Packaging Standard

Advanced Packaging, Chiplets, 2.5D/3D Integration

UCIe โ€ข HBM โ€ข CoWoS โ€ข Fan-Out โ€ข System-in-Package

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4-Phase Implementation

Phase 1: Package Design

Advanced package architecture and substrate design

  • 2.5D interposer design
  • 3D IC stacking topology
  • Chiplet floor planning
  • Fan-out wafer-level packaging
  • RDL (Redistribution Layer) routing
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Phase 2: Thermal & Electrical

Thermal management and signal integrity analysis

  • Thermal resistance calculation
  • Junction temperature prediction
  • Power delivery network design
  • Signal integrity simulation
  • Warpage and stress analysis
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Phase 3: Interconnect

Chiplet interconnect protocols and standards

  • UCIe (Universal Chiplet Interconnect)
  • HBM (High Bandwidth Memory) integration
  • Through-Silicon Via (TSV) design
  • Micro-bump pitch optimization
  • SerDes for die-to-die communication
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Phase 4: Reliability

Package reliability testing and qualification

  • Thermal cycling tests (TCT)
  • Highly Accelerated Stress Test (HAST)
  • Moisture sensitivity level (MSL)
  • Drop and shock testing
  • Electromigration assessment